Component cleaning

Not only clean, but pure

Component cleaning

Well-known companies in the medical engineering, automotive and aviation and aerospace industries rely on our cleaned spring elements. MEDER cleaning and degreasing ensure that our springs and spring elements (and therefore your products) work smoothly and reliably in the future.

We have a range of different processes to cover the cleaning requirements of our customers.

Process:

  • Dipping
  • Swiveling
  • Ultrasonic
  • Multi-chamber process
  • Drying

Cleaning requirements

  • De-oiling and degreasing before heat treatment
  • De-oiling and degreasing before delivery
  • Removal of dirt and chips
  • Fulfillment of restrictive cleanliness requirements for the automotive industry
  • Fulfillment of restrictive cleanliness requirements for the Medical industry

       

Content_waschverfahren

The effect of liquid cleaning processes is determined primarily by the solvent power of the cleaning agents used and by the process applied.


Contaminations must be removed and taken away.


To do this, we use:

  • Hydrocarbons
  • Modified alcohol
  • Aqueous solutions

Technical cleanliness is set out in a nutshell down to the lowest level in VDA 19. Packaging in the clean room after the washing process minimizes contamination risks. This can be documented in the form of a residual dirt analysis.

keine Sauberkeitsforderung Standard Clean Super Clean Super Clean +
MEDER Cleanliness classe No cleanliness requirements Standard Clean Super Clean Super Clean +
Description No cleanliness requirements Parts oil- and grease- free with no special requirement for particlefree processing Parts oil- and grease- free, with particel-free processing according to 'Clean' cleanliness category Parts oil- and grease- free, with particel-free processing according to 'Super Clean' cleanliness category According to
'Super Clean' and in addition packed in our clean-room
CC Code according to VDA 19 - CCC=A(K0) CCC=A(J-K00) CCC=A(I-K00) CCC=A(H-K00) *
max. particle size (µm) - 1000 600 400 200 *
Process description - according to part geometry dipping or swiveling, ultrasonic according to part geometry dipping, turning or swiveling in two-chamber process, ultrasonic according to part geometry dipping, turning or swiveling in multi-chamber process, severale washing media possible, ultrasonic according to part geometry dipping, turning or swiveling in multi-chamber process, several washing media possible, ultrasonic, packaging take place in our clean-room

Data sheet valid for metallic and non metallic particles. Fabers are regarded separately.

In individual cases are deviations possible (unfavorable part geometry, critical surfaces of wires etc.).

Deviations or *higher cleanliness requirements need special specifications.